MediaTek officially unveiled its Helio X20 deca (10) core SoC in May last year, which is being used in several smartphones. Details about the Helio X30, another deca-core SoC surfaced few months back, which said that the phone will use 16nm FinFET process technology, now Chinese electronics industry analyst Pan Jiutang has revealed the it will use 10nm FinFET process technology, similar to upcoming Qualcomm Snapdragon 830 SoC. It is also said to use PowerVR 7-based MP4 GPU.
The weibo user also posted an AnTuTu benchmark comparison chart that reveals a score of 1,60,000 beating Snapdragon 820’s score of 130,000. It must be noted that it is manual data and not official since it doesn’t show a phone running the benchmark.
According to the new leak, it will use two 2.8GHz Artemis CPU cores made by ARM, which is the successor to the Cortex design combined with four 2.2GHz Cortex-A53 CPUs and four 2GHz Cortex-A35 CPUs, instead of Cortex-A72 combination as rumored earlier.
The MediaTek Helio X30 is expected to be announced in June, go into mass production later this year and is said to be used by several flagships releasing early next year.