Qualcomm at the MWC 2018 back in February announced Snapdragon 700 Mobile Platform Series with on-device Artificial Intelligence with multi-core Qualcomm AI Engine offering 2x improvements compared to Snapdragon 600 Series. Now the specifications of Snapdragon 710 (rumored as Snapdragon 670 previously) and Snapdragon 730 have surfaced.
This reveals that the Snapdragon 710 will be built on Samsung 10nm LPE (Low Power Early) process, promising 27% higher performance or 40% lower power consumption compared with 14nm SoCs. The Snapdragon 730 is said to be built on Samsung 8nm LPP (Low Power Plus) process technology which as 10% smaller surface area and 10% less power consumption compared to 10LPP process. Qualcomm is said to be the first company to use 8 LPP process starting with Snapdragon 730.
Both these are rumored to use 2+6 cluster arrangement but the 710 is said to use Kryo 3xx cores compared to Kryo 4xx cores on 730. Both are also expected to use the same Adreno 615 GPU and QHD display support, but the 730 is said to have Spectra 350 ISP compared to Spectra 250 on the 710. The 730 is said to pack NPU (Neural Processing Unit) called NPU120, in addition to GPU and DSP for machine learning applications.
Qualcomm Snapdragon 710 Mobile Platform rumored specifications
- Octa-Core – Dual 2.2GHz Kryo 3xx + Hexa 1.7GHz Kryo 3xx CPUs
- 10nm Samsung LPE process technology
- Up to 16GB memory, 2×16 LPDDR4x 1866MHz, eMMC, UFS 2.1 hear 3 1-lane, SD 3.0, USB 3.1 Gen 1 Type-C & USB 2.0
- Qualcomm Adreno 615 GPU
- Qualcomm Spectra 250 ISP – Up to 32 MP single camera, 3 x Concurrent Cam
- Supports up to QHD (2560×1600) displays, 10 bit + 4K 60 10-bit DP, QSEED3, HDR10 DPU775
- 4K capture at 30fps, Hardware HEVC (H.265) encode and decode
- GPU/HVX machine learning
- Dual-band 802.11ac with MU-MIMO 2×2, GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS and Bluetooth 5
- Qualcomm Quick Charge 4+ technology
Qualcomm Snapdragon 730 Mobile Platform rumored specifications
- Octa-Core – Dual 2.3GHz Kryo 4xx + Hexa 1.8GHz Kryo 4xx CPUs
- 8nm Samsung LPP process technology
- Up to 16GB memory, 2×16 LPDDR4x 1866MHz, eMMC, UFS 2.1 hear 3 1-lane, SD 3.0, USB 3.1 Gen 1 Type-C & USB 2.0
- Qualcomm Adreno 615 GPU
- Qualcomm Spectra 350 ISP – Up to 32 MP single camera, 3 x Concurrent Cam
- Supports up to QHD (2560×1600) displays, 10 bit + 4K 60 10-bit DP, QSEED3, HDR10 DPU775
- 4K capture at 30fps, Hardware HEVC (H.265) encode and decode
- NPU 120 + GPU/HVX machine learning
- Dual-band 802.11ac with MU-MIMO 2×2, GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS and Bluetooth 5
- Qualcomm Quick Charge 4+ technology
The Snapdragon 710 is rumored ship to customers in 1H 2018 and the Snapdragon 730 is rumored to ship only by the end of 2019. Xiaomi is said to be working on a smartphones code-named ‘Comet’ and ‘Sirius’ with Snapdragon 710, so we can expect them later this year. We should know all the details when these SoCs go official later this month.