MediaTek just announced Dimensity 1000, the company’s latest flagship SoC with built-in 5G, as it had promised. It is the company’s first chip to use 7nm process technology, and uses four Cortex-A77 cores operating up to 2.6GHz and four power-efficient ARM Cortex-A55 cores operating at up to 2.0GHz. It also packs ARM Mali-G77 GPU.
The SoC supports 5G two carrier aggregation (2CC CA) with 4.7Gbps downlink and 2.5Gbps uplink speeds over sub-6GHz networks. The chipset is designed to support stand alone and non-stand alone (SA/NSA) sub-6GHz networks, and includes multi-mode support for every cellular connectivity generation from 2G to 5G. It also integrates the latest Wi-Fi 6 and Bluetooth 5.1+ standards.
It comes with MediaTek AI Processing Unit — APU 3.0 — with more than double the performance of the previous generation APU, and brings devices a significant performance boost at 4.5 TOPS.
Features and technology in the MediaTek Dimensity 1000:
- Dual 5G SIM technology, in addition to support for services such as Voice over New Radio (VoNR), the 5G SoC delivers seamless connectivity across networks and offers consistent speeds.
- 5G carrier aggregation. Performs a seamless handover between two connection areas (high speed layer and coverage layer) for seamless high speed connections when users are on the go.
- Five-core image signal processor (ISP) combined with MediaTek’s Imagiq+ technology for support for 80MP cameras sensors at 24 frames per second and a range of multi-camera options such as 32+16MP dual cameras.
- Advanced AI-camera enhancements for autofocus, auto exposure, auto white balance, noise reduction, high-dynamic-range (HDR) and facial detection, along with multi-frame video HDR capability.
- Support for Full HD+ displays up to 120Hz and 2K+ up to 90Hz. First mobile SoC to support Google AV1 format up to 4K resolution at 60fps
The Dimensity 1000 is already shipping to OEMs and the first Dimensity powered devices will start hitting the market in Q1 of 2020, said the company.
MediaTek Dimensity 1000 vs Helio G90T specifications
Dimensity 1000 | Helio G90T | |
Process | 7nm | 12nm |
CPU | 4x Cortex-A77 @ 2.6GHz 4x Cortex-A55 @ 2GHz |
2x Cortex-A76 @ 2.05 GHz 6x Cortex-A55 @ 2GHz |
Memory | 2X LPDDR4x Up to 2133MHz up to 10GB, UFS 2.1 | 2X LPDDR4x Up to 2133MHz up to 10GB, eMMC 5.1 / UFS 2.1 |
Camera | 32MP+16MP, 80MP, Multi-camera
HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD |
24MP+16MP, 64MP, Quad camera
3X ISP; AI Face Detection; HW depth engine; AINR; Single-Cam/Dual-Cam Bokeh; Hardware Warping Engine (EIS); Rolling Shutter Compensation (RSC) engine; MEMA 3DNR; Multi-Frame Noise reduction; |
Display | 2520 x 1080 (Full HD+) at 21:9 120Hz | 2520 x 1080 (Full HD+) at 21:9 90Hz |
Video Decode / Video Encode | 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps, FHD 120fps, HD 240fps | 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps, FHD 120fps, HD 240fps |
Graphics | Mali-G77 MC9 | ARM Mali G76 3EEMC4 @ 800MHz |
Modem | 5G SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback | Cat-12 DL / Cat-13 UL, 4X4 MIMO, 3XCA, 256QAM, TAS 2.0, HPUE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71 |
Connectivity | Integrated Dual-Band Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.1, GPS + Glonass + Beidou + Galileo, FM radio |
Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.0, GPS + Glonass + Beidou + Galileo, FM radio |