HUAWEI’s HONOR brand at the HONOR 30S launch event introduced Kirin 820 SoC, successor of last year’s Kirin 810. It uses 7nm processor technology, similar to the predecessor. This has one ARM Cortex-A76 prime core clocked at 2.36GHz, three ARM Cortex-A76 larger core clocked at 2.22GHz and the other four smaller ARM Cortex-A55 cores are clocked at 1.84GHz, which promises 27% CPU performance improvement compared to the predecessor and the new ARM Mali-G57 MP6 GPU, which has a 38% gaming performance improvement over the previous generation and supports Kirin Gaming+ 2.0 technology.
It also has upgraded NPU with 1.33 TFLOPS computing power offering 73% improvements compared to the predecessor, and uses the same Kirin ISP 5.0 as the Kirin 990, and supports BM3D SLR image noise reduction and video dual-domain noise reduction.
The Kirin 820 5G SoC supports 5G dual-mode, five frequencies, multi-dimensional search, such as network search, uplink / down link speed, and dual SIM experience.
The company did not compare the Kirin 820 with any other processor, but the recent AnTuTu benchmark leak revealed advantages in terms of CPU / GPU performance compared to Kirin 810 and Snapdragon 765G, and almost the same in terms of CPU performance as the Kirin 980.
The Kirin 820 SoC is being rolled out starting from the HONOR 30s, and it should be seen on other HUAWEI and HONOR smartphone releasing later this year and early next year.