MediaTek today introduced the Dimensity 8100 and Dimensity 8000 SoCs with TSMC N5 (5nm-class) production process for premium 5G smartphones. This brings Dimensity 9000’s groundbreaking technology world-firsts including Imagiq 780 photo and video capture engine, 5th generation AI processor, HyperEngine 5.0 gaming enhancements, and Release-16 5G modem.
The Dimensity 8100 has four Arm Cortex-A78 cores with speeds clocked at up to 2.85GHz, and the Dimensity 8000 has four Cortex-A78 cores operating at up to 2.75GHz. These pack Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technologies, frame rates – 170fps for the Dimensity 8100 and 140fps for the Dimensity 8000.
The Dimensity 8100 upgrades gaming with up to 20% more GPU frequency over the Dimensity 8000, and over 25% better CPU power-efficiency over our previous generation Dimensity chips, said the company. Both these features Quad-channel LPDDR5 memory and UFS 3.1 storage ensure ultra-fast data streams.
MediaTek Dimensity 8100 and Dimensity 8000 specifications
| Dimensity 8100 | Dimensity 8000 | |
| Process | 5nm TSMC | |
| CPU | 4x Cortex-A78 @ 2.85GHz 4x Cortex-A55 @ 2GHz |
4x Cortex-A78 @ 2.75GHz 4x Cortex-A55 @ 2GHz |
| Memory | quad-channel LPDDR5 6400Mbps, dual-channel UFS 3.1 | |
| Camera | 200MP, Simultaneous dual camera HDR video recording, 5Gbps 14-bit HDR-ISPs / Video HDR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD | |
| Display | FHD+ @ 168Hz / WQHD+ @ 120Hz | |
| Video Playback / Video Encode | H.264, HEVC, VP-9, AV1 / H.264, HEVC, 4K60 HDR10+
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| Graphics | Arm Mali-G610 MC6 | |
| Modem | 2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA, WDCDMA
5G/4G Dual SIM Dual Standby, SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 2CC, 200MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2×2 MIMO, 256QAM VoNR / EPS fallback |
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| Connectivity | Integrated Wi-Fi 6E (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.3, GPS L1CA+L5 / BeiDou B1I+ B2a + B1C / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC | |
Dimensity 1300
The Dimensity 1300 6nm SoC, succesor to the popular Dimensity 1200 has HDR-ISP that supports up to 200MP, and integrates MediaTek’s HyperEngine 5.0 that offers a comprehensive suite of gaming-related optimizations such as exclusive AI-VRS, Wi-Fi/Bluetooth Hybrid 2.0, plus wireless earbud latency improvements from Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio. The Dimensity 1200 has HyperEngine 3.0 gaming technology.
The AI benchmark scores from the six-core APU 3.0, promises up to 10% improvements for AI tasks, says the company. It comes with new AI enhancements, improving night shot photography and HDR capabilities for great image clarity, says the company.
The Dimensity 1300 has an octa-core CPU with an ultra-core Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores, along with an Arm Mali-G77 MC9 GPU and MediaTek APU 3.0 to support the latest AI capabilities, same as the predecessor.
Availability
Dimensity 8100, Dimensity 8000 and Dimensity 1300-powered phones will roll out in the first quarter of 2022, said MediaTek. Xiaomi has confirmed that a phone in the Redmi K50 series will be powered by Dimensity 8100, and the GT Neo3 will also be powered by the 8100. OnePlus also confirmed a phone with Dimensity 8100 chip. OPPO K10 will also use Dimensity 8000 series chip.