MediaTek today announced Dimensity 1050, its first mmWave 5G chipset for next generation of 5G smartphones. It combines mmWave 5G and sub-6GHz to fluidly migrate between network bands, and is built TSMC 6nm production process. The company said that it will be capable of delivering up to 53% faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone.
In addition, it has MediaTek’s HyperEngine 5.0 gaming technology, UFS 3.1 storage and LPDDR5 memory. This looks like a toned down version of the Dimensity 1100, but with a different Mali-G610 GPU, similar to Dimensity 8000 series.
MediaTek Dimensity 1200 vs 1100 vs 1050 specifications
| Dimensity 1200 | Dimensity 1100 | Dimensity 1050 | ||
| Process | 6nm TSMC | |||
| CPU | 1x Cortex-A78 @ 3GHz 3x Cortex-A78 @ 2.6GHz 4x Cortex-A55 @ 2GHz |
4x Cortex-A78 @ 2.6GHz 4x Cortex-A55 @ 2GHz |
4x Cortex-A78 @ 2.5GHz 4x Cortex-A55 @ 2GHz |
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| Memory | 2X LPDDR4x, up to 16GB, dual-channel UFS 3.1 | LPDDR5, LPDDR4X, UFS 3.1, UFS 2.1 | ||
| Camera | 32MP+16MP, 200MP, Multi-camera, HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD | 32MP+16MP, 108MP, Multi-Camera, HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD | 20MP+20MP, 108MP, Dual HDR video capture hardware 3X HDR-ISP MFNR 3DNR AINR Hardware Depth Engine Warping Engine | |
| Display | 2520 x 1080 (Full HD+) at 21:9 168Hz, QHD+ at 90Hz | 2520 x 1080 (Full HD+) at 21:9 144Hz, QHD+ at 90Hz | 2520 x 1080 (Full HD+) at 21:9 144Hz | |
| Video Playback / Video Encode | H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC | |||
| Graphics | Mali-G77 MC9 | Arm Mali-G610 MC3 | ||
| Modem | True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback | Sub-6GHz (FR1), mmWave (FR2), 2G-5G Multi-Mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM
SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, FR1 TDD+FDD, DSS, FR1 DL 3CC up to 200 MHz, FR2 DL 4CC up to 400MHz, 256QAM FR1 UL 2CC, 256QAM VoNR / EPS fallback |
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| Connectivity | Integrated Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC, FM Radio | |||
Smartphones powered Dimensity 1050 are expected in the third quarter of 2022.
Mediatek Dimensity 930
The company also introduced the Dimensity 930 which actually has Cortex-A78 cores clocked at 2.2GHz, less than Dimensity 900 and 920, but this has new IMG BMX-8-256 GPU.
MediaTek Dimensity 930 vs 920 vs 900 specifications
| Processor | Dimensity 930 | Dimensity 920 | Dimensity 900 |
| Process | 6nm TSMC | ||
| CPU | 2x Cortex-A78 @ 2.2GHz 6x Cortex-A55 @ 2GHz |
2x Cortex-A78 @ 2.5GHz 6x Cortex-A55 @ 2GHz |
2x Cortex-A78 @ 2.4GHz 6x Cortex-A55 @ 2GHz |
| Memory | LPDDR4x, LPDDR5, UFS 2.1,UFS 2.2, UFS 3.1 | ||
| Camera | 64MP, 108MP, Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine | 20MP+20MP, 108MP, Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine | |
| Display | 2520 x 1080 (Full HD+) at 21:9 120Hz | ||
| Video Playback / Video Encode | H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC | ||
| Graphics | IMG BXM-8-256 | Mali-G68 MC4 | |
| Modem | True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback | ||
| Connectivity | Integrated Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC | ||
Smartphones powered Dimensity 930 are expected in the second quarter of 2022.
MediaTek Helio G99
The Helio G99 is a 4G chip which promise more than 30% power savings for gaming compared to the Helio G96 since this uses SMC N6 (6nm-class) chip production process compared to 12nm. It also has slightly higher clock speeds.
| Processor | Helio G99 | Helio G96 |
| Process | TSMC 6nm | TSMC 12nm |
| CPU | 2x Cortex-A76 @ 2.2GHz 6x Cortex-A55 @ 2GHz |
2x Cortex-A76 @ 2.05GHz 6x Cortex-A55 |
| Memory | 2X LPDDR4x Up to 2133MHz, eMMC 5.1 / UFS 2.2 | |
| Camera | 16MP+16MP, 108MP, 32MP @ 30fps ZSL; 16MP + 16MP @ 30fps3X ISP; AI Face Detection; HW depth engine; AINR; Single-Cam/Dual-Cam Bokeh; Hardware Warping Engine (EIS); Rolling Shutter Compensation (RSC) engine; MEMA 3DNR; Multi-Frame Noise reduction; | 26MP+16MP, 108MP, 32MP @ 30fps ZSL; 16MP + 16MP @ 30fps ZSL; 3X ISP; AI Face Detection; HW depth engine; AINR; Single-Cam/Dual-Cam Bokeh; Hardware Warping Engine (EIS); Rolling Shutter Compensation (RSC) engine; MEMA 3DNR; Multi-Frame Noise reduction |
| Display | 2520 x 1080 (Full HD+) at 21:9 120Hz | |
| Video Decode / Video Encode | 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps, FHD 120fps, HD 240fps | |
| Graphics | Arm Mali-G57 MC2 | |
| Modem | Cat-13 DL, 4G Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), 4G FDD / TDD, HSPA +, 4X4 MIMO, 2CC CA, 256QAM, TAS 2.0, HPUE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71 | |
| Connectivity | Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS / QZSS L1+ L5 / Galileo E1 + E5a / BeiDou B1C + B2a / NAVIC | |
Availability
Smartphones powered by the Dimensity 930 are expected during this second quarter of 2022 and smartphones with Dimensity 1050 and the Helio G99 are expected in the third quarter of 2022.