MediaTek introduced the Dimensity 9000 as the world’s first SoC to use TSMC’s 4nm process tech, ARM Cortex-X2 cores and Mali-G710 GPU in November last year. The Dimensity 9000+ was introduced in June, with slightly higher CPU and GPU clock speeds. Now, details about the upcoming Dimensity 9200 has surfaced.
According to leaker, Digital Chat Station, the Dimensity 9200 is in the works skipping Dimensity 9100. Leaker Ice Universe says that it will use ARM Cortex-X3 cores and Immortalis G715 GPU. ARM Cortex-X3 claims a 25% performance boost over the Cortex-X2.
The clock speed and the architecture are not available yet, but the leaker says that the performance will considerably higher.
The Dimensity 9200 chip is expected to still use TSMC’s 4nm process. It is expected to power two vivo phones, including a phone in the X90 series, one phone in the OPPO Find X series, and one other gaming phone.
We can expect the Dimensity 9200 SoC to compete with the Snapdragon 8 Gen 2 SoC, which will also be introduced in November. Unlike the Dimensity 9000 which took several months to arrive in phones, the Dimensity 9200-powered devices are expected in December 2022.