MediaTek has introduced the Dimensity 7200, the company’s first SoC in the new 7000 series. This uses 4nm-class process, same as the 8200, offering improved power efficiency compared to 5nm.
It has an Octa-Core CPU with 2 x Arm Cortex-A715 performance core operating at up to 2.8GHz and 6x Arm Cortex-A510 efficiency cores at 2.0GHz while retaining Mali-G610 graphics engine.
It has HyperEngine 5.0 technology for AI-based Variable Rate Shading (VRS) for power savings, CPU and GPU smart resource optimization for better battery life, and other upgrades for smooth gameplay.
There is support for MediaTek MiraVision Display with HDR supports the latest standards including HDR10+, CUVA HDR and Dolby HDR. AI SDR-to-HDR video playback for enhanced multimedia experiences and Bluetooth LE Audio technology and Dual-Link True Wireless Stereo Audio for wireless earbud support.
The SoC has MediaTek’s Imagiq 765, a 14-bit HDR-ISP, and supports 200MP main cameras. It supports video capturing with 4K HDR video, and even allows users to simultaneously capture content from two cameras at Full HD resolution while keeping everything in focus with all-pixel autofocus technology.
It has built-in 5G modem with s the latest 3GPP Release-16 standard Sub-6GHz 5G modem with up to 4.7Gbps downlink, and supports tri-band Wi-Fi 6E connectivity and next-gen Bluetooth 5.3.
MediaTek Dimensity 7200 vs Dimensity 8200 specifications
| Dimensity 7200 | Dimensity 8200 | |
| Process |
TSMC N4 (4nm-class) |
|
| CPU | 2x Cortex-A715 @ 2.8GHz 6 x Cortex-A510 @ 2.0GHz |
1x Cortex-A78 @ 3.1GHz 3x Cortex-A78 @ 3.0GHz 4x Cortex-A55 @ 2GHz |
| Memory | Quad-channel LPDDR5 6400Mbps, LPDDR4x, dual-channel UFS 3.1 | |
| Camera | Imagiq 765 ISP, 200MP, 14-bit ISP, Video HDR Video EIS Dual simultaneous video capture AI-2A (AI-AF, AI-AWB) All-pixel AF |
Imagiq 785 ISP, 320MP, 32+32+32MP, Simultaneous dual camera HDR video recording, 5Gbps 14-bit HDR-ISPs / Video HDR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD |
| Display | Full HD+ @ 144Hz HDR | FHD+ @ 180Hz / WQHD+ @ 120Hz |
| Video Playback / Video Encode | H.264, HEVC, VP-9, AV1 / H.264, HEVC, 4K60 HDR10+ | |
| Graphics | Arm Mali-G610 MC4 | Arm Mali-G610 MC6 |
| APU | MediaTek 5th generation APU APU 650 |
MediaTek 5th generation APU APU 580 (multi-core) |
| Modem | 2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA, WDCDMA
SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 2CC 200MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2×2 MIMO, 256QAM VoNR / EPS fallback |
|
| Connectivity | Integrated Wi-Fi 6E (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.3, GPS, BeiDou, Glonass, Galileo, QZSS, NavIC | |
Availability
The MediaTek Dimensity 7200 will power 5G devices launching in the global market in Q1 2023. Based on earlier rumours, vivo V27 that is launching soon will be one of the first devices with the chip.