AMD has announced its latest mobile CPU, the Ryzen 9 7945HX3D, at this year’s ChinaJoy expo. This new chip is designed for high-end gaming laptops and is equipped with AMD’s cutting-edge 3D V-Cache packaging technology.
The Ryzen 9 7945HX3D is AMD’s first mobile CPU with extended L3 cache technology, providing even better performance for select workloads that can utilize the additional cache.
The Ryzen 9 7945HX3D joins AMD’s current lineup of desktop replacement-class mobile SKUs, known as the Ryzen 7045HX ‘Dragon Range’ series, and serves as its new flagship mobile part.
With 16 Zen 4 CPU cores and a sizable 128MB L3 cache, the Ryzen 9 7945HX3D embodies AMD’s highest-level performance for this generation.
3D V-Cache Technology: Enhancing Gaming Performance
The Ryzen 9 7945HX3D is the first mobile processor to incorporate AMD’s 3D V-Cache packaging technology. This innovative concept involves stacking an additional 64 MB slice of L3 cache on top of one of the core complex dies (CCD), resulting in a total of 96 MB L3 cache on the V-Cache CCD.
The other CCD remains unchanged with 32 MB L3 cache. The 3D layering process efficiently integrates the additional cache into the processor without the need for a larger compute core complex, leading to significant performance improvements in games that can take advantage of more L3 cache.
Improved Efficiency and Performance
AMD’s slide deck reveals that the Ryzen 9 7945HX3D maintains efficiency at various power envelopes, including 70 W and 40 W. According to AMD, the 3D V-Cache Ryzen 9 7945HX is up to 23% more efficient at 40 W than its non-3D V-Cache counterpart.
This mobile CPU boasts 16 cores and 32 threads, making it a top choice for gamers who require high CPU power alongside premium graphics cards.
Performance Guidance and Laptop Partner
AMD claims the Ryzen 9 7945HX3D, with its 128 MB of 3D V-Cache, is more than 15% faster than the Ryzen 9 7945X when gaming at 1080p with high settings.
The ASUS ROG Strix SCAR 17 X3D is the first notebook announced to use the Ryzen 9 7945HX3D and is likely to be AMD’s launch partner for this new mobile CPU.
Quick specifications: AMD Ryzen 9 7945HX3D
- Platform: Laptop
- Architecture: Zen 4
- CPU Cores: 16
- Threads: 32
- Max. Boost Clock: Up to 5.4GHz
- Base Clock: 2.3GHz
- L1 Cache: 1MB
- L2 Cache: 16MB
- L3 Cache: 128MB
- Default TDP: 55W
- Processor Technology for CPU Cores: TSMC 5nm FinFET
- AMD Configurable TDP (cTDP): 55-75W
- CPU Socket: FL1
- OS Support: Windows 10 & 11 – 64-Bit Edition; RHEL x86 64-Bit and Ubuntu x86 64-Bit
- PCI Express Version: PCIe 5.0
- System Memory Type: DDR5
- Max. Memory: 64GB
- Memory Channels: 2
- Graphics Model: AMD Radeon 610M
- Graphics Core Count: 2
- Graphics Frequency: 2200 MHz
- AMD EXPO Memory Overclocking Technology, Multithreading
- NVMe Support: Boot, RAID0, RAID1, RAID10
Pricing and release date
The AMD Ryzen 9 7945HX3D is set to launch on August 22, 2023. Pricing details for the laptops powering it have not been provided, and more information about the chip and supported laptops will be unveiled closer to the release date.