MediaTek has introduced Dimensity 6300 SoC in the Dimensity 6000 series after the launch of Dimensity 6100+ last year. It integrates an enhanced 5G modem supporting 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation and has MediaTek UltraSave 3.0+ technology for power saving, same as the 6100+.
The chip has two Arm Cortex-A76 big cores clocked at 2.4GHz and six Arm Cortex-A55 efficiency cores, clocked at 2GHz. It promises up to 10% faster CPU performance than the previous generation, and over 50% GPU performance.
| Processor | Dimensity 6300 | Dimensity 6100+ | Dimensity 6020 |
| Process | TSMC N6 (6nm-class) | ||
| CPU | 2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz | 2x Cortex-A76 @ 2.2GHz 6x Cortex-A55 @ 2GHz | 2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz |
| Memory | LPDDR4x 2133MHz, UFS 2.2 (2-lane) | ||
| Camera | 16MP+16MP, 108MP,Hardware MFNR, 3DNR, AI-FD | ||
| Display | 2520 x 1080 (Full HD+) at 21:9 120Hz | ||
| Video Decode / Video Encode | 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps | ||
| Graphics | Arm Mali-G57 MC2 | ||
| Modem | 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA | ||
| Connectivity | Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS L1CA+L5 BeiDou B1I+ B2a Glonass L1OF Galileo E1 + E5a QZSS L1CA+ L5 NavIC | ||
Availability
The first smartphone powered by Dimensity 6300 SoC is expected to be realme C65 5G, which should launch in India later this month, followed by other markets.