AMD just announced the Ryzen AI 300 Series, built on the new AMD XDNA 2 architecture with built-in NPU for for Copilot + PCs at the Computex 2024.
These include AMD AI 9 HX 370 and AI 9 365 that feature up to 12 high-performance ‘Zen 5’ cores, 24 threads, new AMD RDNA 3.5 graphics architecture, with the latest AMD Radeon 800M Series graphics.
These offer 50% more on-chip L3 cache memory over previous gen “Zen 4” processors for thin and light laptops.
The processors offer 50 TOPS of AI processing power, surpassing Copilot+ AI PC requirements, with three times the AI engine performance of the second generation of AMD Ryzen AI, said the company.
Model | Cores / Threads |
Boost9 / Base Frequency | Total Cache |
Graphics Model |
TDP | NPU |
AMD Ryzen AI 9 HX 370 | 12 / 24 | 5.1 GHz / 2.0 GHz |
36MB | AMD Radeon 890M Graphics | 15-54W | Yes (50 TOPs) |
AMD Ryzen AI 9 365 | 10 / 20 | 5.0 GHz / 2.0GHz |
34MB | AMD Radeon 880M Graphics | 15-54W | Yes (50 TOPs) |
AMD has also compared the performance of the Ryzen AI 9 HX 370 with the Snapdragon X Elite, Apple M3, and Intel Core Ultra 185H. AMD says that the Ryzen AI 300 series promise up to an average of 36% more performance compared to the Intel Core Ultra 185H.
OEM Partners
AMD has announced that it is working closely with industry partners and OME partners for laptops with Ryzen AI 300 Series processors.
OEM partners including Acer, ASUS, HP, Lenovo and MSI are unveiling new laptops with the chips which will roll out starting from July 2024. Microsoft and Zoom are working closely with AMD to expand the possibilities of AI PCs, said the company.