Samsung has announced mass production of the industry’s thinnest 12-nanometer (nm) LPDDR5X DRAM packages, boasting 12 and 16 gigabytes (GB) of capacity.
Leveraging its extensive chip packaging expertise, Samsung has created ultraslim LPDDR5X DRAM packages that maximize space within mobile devices, enhancing airflow and thermal control. Compared to the previous generation, they are approximately 9% thinner and exhibit 21.2% improved heat resistance.
This is crucial for high-performance applications featuring advanced capabilities like on-device AI.
Through optimized printed circuit board (PCB) and epoxy molding compound (EMC) techniques, the new LPDDR DRAM package achieves a remarkable 0.65-millimeter (mm) thickness, surpassing all existing LPDDR DRAM options of 12GB or higher. Samsung’s refined back-lapping process further minimizes package height.
Samsung aims to expand its presence in the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to both mobile processor and device manufacturers.
As demand for high-performance, high-density mobile memory solutions in compact packages continues to rise, the company plans to introduce even thinner LPDDR DRAM packages, including 6-layer 24GB and 8-layer 32GB modules, for future devices.
YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics, said:
Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package. We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.