xMEMS Labs has unveiled the xMEMS XMC-2400 µCooling chip, marking a breakthrough in micro-cooling technology. This innovative chip is the first all-silicon, active micro-cooling fan engineered for ultramobile devices and advanced AI applications.
Key Features and Specifications
The xMEMS XMC-2400 integrates seamlessly into modern mobile devices. With dimensions of just 9.26 x 7.6 x 1.08 millimeters and a weight under 150 milligrams, it is 96% smaller and lighter than conventional active-cooling alternatives.
Despite its compact size, the chip can move up to 39 cubic centimeters of air per second while generating 1,000Pa of back pressure. The all-silicon design ensures high reliability, consistent performance, and durability, with an IP58 rating for added robustness.
Manufacturing and Availability
The XMC-2400 is produced using a similar fabrication process to the award-winning xMEMS Cypress micro speaker.
- xMEMS plans to begin sampling the XMC-2400 to customers in the first quarter of 2025.
- Full-scale production for the xMEMS Cypress speaker is anticipated to start in the second quarter of 2025.
In September 2024, xMEMS will present the XMC-2400 at xMEMS Live events in Shenzhen and Taipei, showcasing the chip to key customers and industry partners.
Speaking about the chip, Joseph Jiang, xMEMS CEO and Co-Founder, stated,
Our innovative µCooling ‘fan-on-a-chip’ design arrives at a pivotal moment in mobile computing. As ultramobile devices start to handle more processor-intensive AI tasks, managing heat becomes a significant challenge for both manufacturers and consumers. Until the XMC-2400, there was no viable active-cooling solution for such compact and thin devices.
Having introduced MEMS micro speakers to the consumer electronics market, with over half a million units shipped in the first half of 2024, we are now revolutionizing thermal management with µCooling.
The XMC-2400 is engineered to actively cool even the smallest handheld devices, paving the way for the slimmest and highest-performing AI-ready mobile devices. It’s difficult to envision the future of smartphones and other performance-focused devices without xMEMS µCooling technology.