MediaTek has scheduled an event on December 23rd in China to introduce its next generation Dimensity chip. The invite doesn’t reveal any other details, but based on rumours, it is expected to introduce the Dimensity 8400 SoC as the successor to Dimensity 8300 SoC.
The Octa-Core processor is said to retain the TSMC 4nm process from the Dimensity 8300, but use a new architecture that will use all Cortex-A725 cores, replacing the A5xx cores.
It is said to use 1 x 3.25GHz Cortex A725 Core, 3 x 3.0GHz Cortex A725 Cores, 4 x 2.1GHz Cortex A725 Cores and 1.3GHz Immortalis G720 MC7 GPU.
This is said to have a score of 1.8 million points on AnTuTu which is way better than the 1.52 million points for the Redmi K70E in China and 1.48 million points for POCO X6 Pro in global markets, both powered by Dimensity 8300-Ultra SoC.
The Dimensity 8400 could power the Redmi Turbo 4, which is expected to be introduced sometime early next year. This replaces the Snapdragon 8s Gen 3 which was present in the Redmi Turbo 3.
We should know all the details, including the first device it will power when it goes official next week.