realme already confirmed that it will be one of the first companies to use MediaTek Dimensity 8400 SoC in its phone, and earlier rumors revealed that it will be the realme Neo7 SE.
Now, leaker Digital Chat Station has revealed that the phone will use Dimensity 8400-Max SoC, a new name different from Dimensity 8400-Ultra used in the Redmi Turbo 4, which is the first device to use the chip.
The leaker also revealed that the Neo7 SE will feature a 1.5K flat OLED screen, and has also shared an image of the phone from MIIT certification, which has the model number RMX5080.
The image shows dual rear cameras, which is said to be 50MP main camera with Sony IMX882 sensor along with an ultra-wide camera, which should use a 8MP sensor. The phone is said to feature a plastic frame, optical in-display fingerprint scanner and a huge 7000mAh battery with support for 80W fast charging.
The realme Neo7 SE should be introduced sometime in February, which is next month.