MediaTek just announced the Dimensity 9400+ as the upgraded version of the Dimensity 9400 ahead of tomorrow’s MediaTek Dimensity Developer Conference (MDDC) 2025.
Faster CPU
It retains the second-generation TSMC’s 3nm process tech and the second-generation all-large core CPU architecture, but the Arm Cortex-X925 core now operates at up to 3.73GHz compared to 3.62GHz while retaining 3 x Cortex-X4 performance cores clocked at 3.30 GHz and 4 x Cortex-A720 effeciency cores clocked at 2.4GHz.
Improved APU
The Dimensity 9400+ boasts improved AI processing over the previous generation. The MediaTek NPU 890 supports a wide range of LLMs across many regions around the world.
The chipset supports Mixture-of-Experts (MoE), Multi-Head Latent Attention (MLA), Multi-Token Prediction (MTP), and FP8 inferencing with faster reasoning speeds. It also offers 20% faster agentic AI performance with Speculative Decoding+ (SpD+).
GPU Improvements
The Dimensity 9400+ integrates a 12-core Arm Immortalis-G925 GPU. It brings opacity micromap (OMM) support for realistic effects. The Dimensity 9400+ also includes a new frame rate converter 2.0+ (MFRC 2.0+), which was developed in coordination with game developers to double effective FPS and enhances power efficiency by up to 40% when MFRC is utilized.
ISP
The chip retains the MediaTek Imagiq 1090 that enables HDR video recording across the entire zoom range. MediaTek’s Smooth Zoom technology provides seamless capture of moving subjects while allowing users to isolate the image and audio they want in each scene, said the company.
Additional features
- Expands phone-to-phone direct Bluetooth connections to 10km, extending 6.6x further than the Dimensity 9400.
- Support for a BeiDou satellite connection, offering 33% faster TTFF (Time to first fix), even without cellular connectivity.
- Wi-Fi 7 tri-band concurrency with five streams.
- MediaTek Xtra Range 3.0, which delivers up to 30m greater Wi-Fi coverage.
MediaTek Dimensity 9400+ specifications
- 1x Arm Cortex-X925, 2MB L2 cache, up to 3.73 GHz + 3x Arm Cortex-X4, 1MB L2 cache + 4x Arm Cortex-A720, 512KB L2 cache
- 12MB L3 cache + 10MB SLC
- Arm Immortalis-G925 MC12 GPU, New MediaTek Frame Rate Converter (MFRC) 2.0+ with up to 40% power saving, MediaTek Adaptive Gaming Technology (MAGT) 3.0
- MediaTek NPU 890 (Generative AI, Agentic AI), 20% faster agentic AI performance with Speculative Decoding+ (SpD+)
- TSMC’s second generation 3nm process
- WQHD+ at 180Hz, Tri-port MIPI for Tri-Fold Displays
- Up to 320MP camera, Imagiq 1090
- 3GPP-R17, Sub-6GHz (FR1), 2G-5G multi-mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM
- 5G/4G Dual SIM Dual Active, Dual Data, SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR FR1 TDD+FDD, DSS, 256QAM VoNR / EPS fallback
- GPS L1CA+L5+L1C, BeiDou B1I+ B1C + B2a +B2b, Glonass L1OF, Galileo E1 + E5a + E5b, QZSS L1CA + L5, NavIC L5
- Wi-Fi 7 (a/b/g/n/ac/ax/be), Triple Band Triple Concurrency (TBTC), Bluetooth 6.0 with dual Bluetooth engine, 12Mbps
- LPDDR5X 10667 9600Mbps memory up to 10.7Gbps,UFS 4 + MCQ
Availability
The first smartphones powered by the MediaTek Dimensity 9400+ will be available in the market this month, said MediaTek.
OPPO has already confirmed that the Find X8s and X8s+ which will be introduced today in China will use the chip. The vivo X200s and realme GT7 will also use the chip.