MediaTek Dimensity 8400, the company’s upcoming 8000 series chip is all set to be introduced later this month, and the detailed specifications of it has been revealed, thanks to leaker Digital Chat Station.
The Octa-Core processor is said to retain the TSMC 4nm process from the Dimensity 8300, but use a new architecture that will use all Cortex-A725 cores, replacing the A5xx cores.
- 1 x 3.25GHz Cortex A725 Core
- 3 x 3.0GHz Cortex A725 Cores
- 4 x 2.1GHz Cortex A725 Cores
- 1.3GHz Immortalis G720 MC7 GPU
This is said to score 1.8 million points on AnTuTu which is way better than the 1.52 million points for the Redmi K70E in China and 1.48 million points for POCO X6 Pro in global markets, both powered by Dimensity 8300-Ultra SoC.
The Dimensity 8400 could power the Redmi Turbo 4, which is expected to be introduced sometime early next year. This replaces the Snapdragon 8s Gen 3 which was present in the Redmi Turbo 3. For the global markets, this was launched as POCO F6 and scored 1.52 million points on AnTuTu.
Based on earlier rumours, the Redmi Turbo 4 will feature a 1.5K LTPS flat screen with ultra-narrow bezels, glass back, plastic frame, optical fingerprint scanner, 50MP rear camera, and a 6500mAh battery.
The MediaTek Dimensity 8400 is expected to be introduced on December 23rd, which is tentative, according to the leaker, and we should get the official confirmation in the coming days.