Samsung at the annual Samsung Tech Day in San Jose, California announced that is has started mass production of first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) UFS-based multichip package (uMCP). Samsung introduced 12GB LPDDRX chips with 1y-nanometer process technology back in March that combines six 16-gigabit (Gb) LPDDR4X chips (16Gb=2GB) based on the second-generation 10nm-class (1y-nm) process into a single package. Continue reading “Samsung starts mass production of first 12GB LPDDR4X + eUFS 3.0 multichip package”