HUAWEI just announced Kirin 990 and Kirin 990 5G SoCs at its IFA event as expected. The Kirin 990 is based on Taiwan Semiconductor Manufacturer Company’s (TSMC) 7nm process, while the Kirin 990 5G that has built-in 5G modem supporting Sub-6 GHz 5G networks on both SA and NSA architectures and uses TSMC’s latest 7nm plus EUV manufacturing, which helps enable a smaller die size offering 36% board reduction, increased transistor density by 18% and 10% improvement in energy efficiency. These have 16-Core Mali-G76 GPU, compared to 10-Core in the Kirin 980 SoC offering 6% improvement in graphics processing performance.
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