MediaTek today announced Dimensity 1050, its first mmWave 5G chipset for next generation of 5G smartphones. It combines mmWave 5G and sub-6GHz to fluidly migrate between network bands, and is built TSMC 6nm production process. The company said that it will be capable of delivering up to 53% faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone. Continue reading “MediaTek Dimensity 1050 mmWave 5G, Dimensity 930 5G and Helio G99 4G 6nm SoCs announced”