Tag: Realme X50 5G

Realme X50 5G with 6.57-inch FHD+ 120Hz display, Snapdragon 765G, 64MP quad rear cameras, dual in-screen front cameras announced

realme just announced X50 5G, the company’s first 5G smartphone at an event in China as it had promised. It packs a 6.57-inch FHD+ LCD screen with 120Hz refresh rate and 90.48% screen to body ratio and the punch-hole screen houses a 16MP camera as well as an 8MP 105° ultra-wide sensor, is powered by Snapdragon 765G with up to 12GB RAM and support for built-in 5G stand alone and non-stand alone (SA/NSA) sub-6GHz networks. It features 8mm liquid-cooled copper pipe 3.0 for improved heat dissipation. Continue reading “Realme X50 5G with 6.57-inch FHD+ 120Hz display, Snapdragon 765G, 64MP quad rear cameras, dual in-screen front cameras announced”

Realme X50 5G with dual punch-hole display, Snapdragon 765G, liquid Cooling, VOOC 4.0 to be announced on January 7

Update: December 27, 2019 — realme China product director Wang Wei Derek has posted a new photo of the phone that confirms side-mounted fingerprint scanner.

Continue reading “Realme X50 5G with dual punch-hole display, Snapdragon 765G, liquid Cooling, VOOC 4.0 to be announced on January 7”

Realme X50 5G phone with Snapdragon 765G, dual punch-hole display teased [Update: Liquid Cooling, 70% charge in 30 min with VOOC 4.0]

Update: December 20, 2019 — realme has confirmed that X50 5G  will feature 8mm 410mm³ diameter large  liquid-cooled copper tube for heat dissipation 3.0 offering five-dimensional heat dissipation that covers all the heat sources 100%. It will feature enhanced VOOC flash charge 4.0,  so that the phone is charged from 0 to 70% in 30 minutes.

Continue reading “Realme X50 5G phone with Snapdragon 765G, dual punch-hole display teased [Update: Liquid Cooling, 70% charge in 30 min with VOOC 4.0]”