MediaTek Dimensity 9500 has surfaced in Geekbench OpenCL benchmark for the first time, after rumours. This reveals that it will still be an Octa-core processor with 1 x Travis+3 x Alto+4 x Gelas architecture. Continue reading “MediaTek Dimensity 9500 surfaces in benchmarks”
MediaTek introduced the MediaTek Dimensity 9400e chipset earlier today. realme today confirmed that the realme GT 7 will be the first phone in the South Asia, Europe, Southeast Asia, Latin America, Middle East and North Africa, and other more regions to use the chip. Continue reading “realme GT 7 to be powered by MediaTek Dimensity 9400e”
At the OnePlus Game Strategic Communication Conference in China, MediaTek introduced its Dimensity 9400e processor, which is an enhanced version of last year’s Dimensity 9300+. Continue reading “MediaTek Dimensity 9400e official, to power OnePlus Ace5 Racing Edition”
MediaTek Dimensity 9400+ was introduced earlier this month, now the details about the upcoming flagship Dimensity 9500 processor has surfaced, thanks to leaker Digital Chat Station. Continue reading “MediaTek Dimensity 9500 details surface, 100TOPS NPU?”
MediaTek just announced the Dimensity 9400+ as the upgraded version of the Dimensity 9400 ahead of tomorrow’s MediaTek Dimensity Developer Conference (MDDC) 2025. Continue reading “MediaTek Dimensity 9400+ official: Faster CPU, NPU and better connectivity”
MediaTek launched the Kompanio Ultra 910 processor for Chromebook Plus laptops, featuring Agentic AI and high performance. The company states it powers “the highest performing Chromebooks yet, while also delivering all-day battery life.” Continue reading “MediaTek Kompanio Ultra 910 processor with On-Device AI for Chromebooks announced”
Google is reportedly preparing to partner with Taiwan’s MediaTek to develop its next-generation AI chips, known as Tensor Processing Units (TPUs), set to launch in 2026, according to The Information. Continue reading “Google eyeing MediaTek for AI TPU manufacturing: Report”
MediaTek has introduced Dimensity 7400, another 7000 series chipset, as the successor to last year’s Dimensity 7300. Similar to last year, there is also Dimensity 7400X designed for flip-style foldable devices with support for dual displays. Continue reading “MediaTek Dimensity 7400 and Dimensity 7400X announced”
MediaTek just announced the Dimensity 8400 as the successor to last year’s Dimensity 8300 SoC, as it had promised. This brings an All Big Core design to the premium smartphone market for the first time, said the company. Continue reading “MediaTek Dimensity 8400 SoC official; Dimensity 8400-Ultra to power Redmi Turbo 4”
MediaTek has scheduled an event on December 23rd in China to introduce its next generation Dimensity chip. The invite doesn’t reveal any other details, but based on rumours, it is expected to introduce the Dimensity 8400 SoC as the successor to Dimensity 8300 SoC. Continue reading “MediaTek to introduce next-gen Dimensity chip on December 23 — Dimensity 8400 expected”
MediaTek Dimensity 8400, the company’s upcoming 8000 series chip is all set to be introduced later this month, and the detailed specifications of it has been revealed, thanks to leaker Digital Chat Station. Continue reading “MediaTek Dimensity 8400 detailed specs surface, could go official on December 23”
MediaTek just announced Dimensity 9400, the company’s latest flagship SoC, as the successor to Dimensity 9300 / 9300+. It uses second-generation TSMC’s 3nm process tech and the second-generation all-large core CPU architecture.
MediaTek is gearing up to introduce the Dimensity 9400, the company’s flagship SoC, as the successor to Dimensity 9300 in October. Earlier rumours revealed that vivo X200 series will be the first to be powered by the chip, with OPPO Find X8 series to follow. Continue reading “OPPO Find X8 with Dimensity 9400 surfaces in benchmarks”
Airtel, in collaboration with MediaTek and Nokia, has announced that it has successfully conducted trials that efficiently combine TDD and FDD mid-band spectrum on a time-based basis. Continue reading “Airtel, MediaTek, Nokia achieve 5G uplink breakthrough”
MediaTek has officially announced the Helio G100, the company’s latest 4G SoC, as the successor of Helio G99 which was introduced back in 2022. This uses the same TSMC’s advanced 6nm (N6) chip production process, has ARM Cortex-A76 CPU cores clocked up to 2.2GHz and six power efficient Cortex-A55 cores clocked at 2GHz along with ARM Mali-G57 MC2 GPU. Continue reading “MediaTek Helio G100 Octa-Core 6nm SoC announced”
